To extend the temporary suspension of duty on epoxy molding compounds, of a kind used for encapsulating integrated circuits.

Amends the Harmonized Tariff Schedule of the United States to extend the temporary suspension of duty on epoxy molding compounds, of a kind used for encapsulating integrated circuits.

[Congressional Bills 112th Congress]
[From the U.S. Government Publishing Office]
[H.R. 5422 Introduced in House (IH)]

112th CONGRESS
  2d Session
                                H. R. 5422

To extend the temporary suspension of duty on epoxy molding compounds, 
         of a kind used for encapsulating integrated circuits.


_______________________________________________________________________


                    IN THE HOUSE OF REPRESENTATIVES

                              May 7, 2012

  Mr. Honda introduced the following bill; which was referred to the 
                      Committee on Ways and Means

_______________________________________________________________________

                                 A BILL


 
To extend the temporary suspension of duty on epoxy molding compounds, 
         of a kind used for encapsulating integrated circuits.

    Be it enacted by the Senate and House of Representatives of the 
United States of America in Congress assembled,

SECTION 1. EPOXY MOLDING COMPOUNDS, OF A KIND USED FOR ENCAPSULATING 
              INTEGRATED CIRCUITS (PROVIDED FOR IN SUBHEADING 
              3907.30.00).

    (a) In General.--Heading 9902.01.85 of the Harmonized Tariff 
Schedule of the United States (relating to epoxy molding compounds, of 
a kind used for encapsulating integrated circuits (provided for in 
subheading 3907.30.00)) is amended by striking the date in the 
effective period column and inserting ``12/31/2015''.
    (b) Effective Date.--The amendment made by subsection (a) applies 
to goods entered, or withdrawn from warehouse for consumption, on or 
after the 15th day after the date of the enactment of this Act.
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