Creating Helpful Incentives to Produce Semiconductors for America Act or the CHIPS for America Act
This bill establishes investments and incentives to support U.S. semiconductor manufacturing, research and development, and supply chain security.
Specifically, the bill provides an income tax credit for semiconductor equipment or manufacturing facility investment through 2026. The bill also establishes a trust fund to be allocated upon reaching an agreement with foreign government partners to promote (1) consistency in policies related to microelectronics, (2) transparency in microelectronic supply chains, and (3) alignment in policies towards nonmarket economies.
The Department of Commerce shall, through the National Institute of Standards and Technology (NIST), carry out a program of research and development investment to accelerate the design, development, and manufacturability of next generation microelectronics, including through the creation of a Manufacturing USA institute for semiconductor manufacturing. Commerce shall also establish a program to match state and local government incentives offered to private entities for the purposes of building fabrication facilities relating to semiconductor manufacturing. Further, Commerce shall assess the capabilities of the U.S. industrial base to support the national defense in light of the global nature of supply chains and interdependencies between the industrial bases of the U.S. and foreign countries with respect to the manufacture and design of semiconductors.
The Department of Defense shall prioritize the use of specified available amounts for programs, projects, and activities in connection with semiconductor and related technologies.
The President shall establish within NIST a subcommittee on matters relating to U.S. leadership in semiconductor technology and innovation, which shall develop a national strategy on semiconductor research.
[Congressional Bills 116th Congress]
[From the U.S. Government Publishing Office]
[H.R. 7178 Introduced in House (IH)]
<DOC>
116th CONGRESS
2d Session
H. R. 7178
To restore American leadership in semiconductor manufacturing by
increasing Federal incentives in order to enable advanced research and
development, secure the supply chain, and ensure long-term national
security and economic competitiveness.
_______________________________________________________________________
IN THE HOUSE OF REPRESENTATIVES
June 11, 2020
Mr. McCaul (for himself and Ms. Matsui) introduced the following bill;
which was referred to the Committee on Science, Space, and Technology,
and in addition to the Committees on Ways and Means, Armed Services,
Financial Services, Energy and Commerce, and Foreign Affairs, for a
period to be subsequently determined by the Speaker, in each case for
consideration of such provisions as fall within the jurisdiction of the
committee concerned
_______________________________________________________________________
A BILL
To restore American leadership in semiconductor manufacturing by
increasing Federal incentives in order to enable advanced research and
development, secure the supply chain, and ensure long-term national
security and economic competitiveness.
Be it enacted by the Senate and House of Representatives of the
United States of America in Congress assembled,
SECTION 1. SHORT TITLE.
This Act may be cited as the ``Creating Helpful Incentives to
Produce Semiconductors for America Act'' or the ``CHIPS for America
Act''.
SEC. 2. SEMICONDUCTOR INVESTMENT TAX CREDIT.
(a) Establishment of Credit.--Subpart E of part IV of subchapter A
of chapter 1 of the Internal Revenue Code of 1986 is amended by
inserting after section 48C the following:
``SEC. 48D. QUALIFYING SEMICONDUCTOR EQUIPMENT CREDIT.
``(a) In General.--For purposes of section 46, the qualifying
semiconductor equipment credit for any taxable year is the applicable
percentage of--
``(1) the basis of any qualified semiconductor equipment
placed in service during such taxable year,
``(2) any qualified semiconductor manufacturing facility
investment expenditures incurred during such taxable year, and
``(3) any expenses incurred by the taxpayer during such
taxable year with respect to entering into a lease (including
renewal or extension of a lease) for qualified semiconductor
equipment.
``(b) Applicable Percentage.--For purposes of subsection (a), the
applicable percentage is--
``(1) 40 percent in the case of any qualified semiconductor
equipment which is placed in service before January 1, 2025, or
any qualified semiconductor manufacturing facility investment
expenditures or expenses described in subsection (a)(3) which
are incurred before such date,
``(2) 30 percent in the case of any such equipment which is
placed in service, or any such expenditures or expenses which
are incurred, after December 31, 2024, and before January 1,
2026,
``(3) 20 percent in the case of any such equipment which is
placed in service, or any such expenditures or expenses which
are incurred, after December 31, 2025, and before January 1,
2027, and
``(4) 0 percent in the case of any such equipment which is
placed in service, or any such expenditures or expenses which
are incurred, after December 31, 2026.
``(c) Qualified Semiconductor Equipment.--For purposes of this
section, the term `qualified semiconductor equipment' means any
property--
``(1) which has been identified by the Secretary, in
consultation with the Secretary of Commerce, as machinery or
equipment that is designed and used to--
``(A) manufacture or process semiconductors, or
``(B) perform research with respect to
semiconductors,
``(2) which is placed in service in the United States by
the taxpayer, and
``(3) with respect to which depreciation (or amortization
in lieu of depreciation) is allowable.
``(d) Qualified Semiconductor Manufacturing Facility Investment
Expenditures.--For purposes of this section, the term `qualified
semiconductor manufacturing facility investment expenditure' means any
amount properly chargeable to capital account--
``(1) for property for which depreciation is allowable
under section 168, and
``(2) in connection with the construction or upgrading of
any facility located in the United States which substantially
operates qualified semiconductor equipment, including--
``(A) costs relating to--
``(i) acquiring or upgrading an existing
building, or
``(ii) construction of a new building, and
``(B) property such as--
``(i) integrated systems, fixtures, piping,
movable partitions, and lighting, and
``(ii) any property which has been
identified by the Secretary, in consultation
with the Secretary of Commerce, as necessary or
adapted to--
``(I) reduce contamination, or
``(II) control air flow,
temperature, humidity, chemical purity,
or other environmental conditions or
manufacturing tolerances.
``(e) Certain Progress Expenditure Rules Made Applicable.--Rules
similar to the rules of subsections (c)(4) and (d) of section 46 (as in
effect on the day before the date of the enactment of the Revenue
Reconciliation Act of 1990) shall apply for purposes of subsection (a).
``(f) Treatment of Credit.--The amount of the credit determined
under this section with respect to any qualified semiconductor
equipment placed in service before January 1, 2027, or any qualified
semiconductor manufacturing facility investment expenditures incurred
before such date, shall be treated as a credit allowable under subpart
C (and not allowable under section 38).
``(g) Denial of Double Benefit.--
``(1) Reduction of basis.--If a credit is determined under
this section with respect to any property, the basis of such
property shall be reduced by the amount of the credit so
determined.
``(2) Other credits.--No credit shall be allowed under any
provision of this chapter with respect to any amount taken in
account in determining the credit allowed to a taxpayer under
this section.
``(h) Rules Relating to Leased Property.--For purposes of
subsection (a)(3), rules similar to the rules under section 48(d) (as
in effect on the day before the date of the enactment of the Revenue
Reconciliation Act of 1990) shall apply.
``(i) Disallowance.--No credit shall be allowed under this section
with respect to any qualified semiconductor equipment which is used
predominantly outside the United States.
``(j) Partnerships.--In the case of a credit under subsection (a)
which is determined at the partnership level, with respect to any
partner which is exempt from taxation under section 501(a), such
partner may elect to transfer their distributive share of such credit
to any other partner in the partnership.
``(k) Regulations.--The Secretary shall prescribe such regulations
or other guidance as may be necessary to carry out the purposes of this
section, including any such measures as are deemed appropriate to avoid
abuse or fraud with respect to the credit allowed under this
section.''.
(b) Tax on Base Erosion Payments of Taxpayers With Substantial
Gross Receipts.--Section 59A(b)(1)(B)(ii) of the Internal Revenue Code
of 1986 is amended--
(1) in subclause (II), by striking the period at the end
and inserting ``, plus'', and
(2) by adding at the end the following:
``(III) the credit determined under
section 48D for the taxable year.''.
(c) Investment Credit.--Section 46 of the Internal Revenue Code of
1986 is amended by striking ``and'' at the end of paragraph (5), by
striking the period at the end of paragraph (6) and inserting ``,
and'', and by adding at the end the following new paragraph:
``(7) the qualifying semiconductor equipment credit.''.
(d) Clerical Amendment.--The table of sections for subpart E of
part IV of subchapter A of chapter 1 of the Internal Revenue Code of
1986 is amended by inserting after the item relating to section 48C the
following new item:
``Sec. 48D. Qualifying semiconductor equipment credit.''.
(e) Effective Date.--The amendments made by this section shall
apply to any qualified semiconductor equipment (as defined in
subsection (c) of section 48D) placed in service after the date of
enactment of this Act, or any qualified semiconductor manufacturing
facility investment expenditure (as defined in subsection (d) of such
section) incurred after such date.
SEC. 3. BUILDING UNITED STATES CAPACITY FOR VERIFICATION AND
MANUFACTURING OF ADVANCED MICROELECTRONICS.
(a) Program.--The Secretary of Commerce, acting through the
Director of the National Institute of Standards and Technology, shall
carry out a program of research and development investment to enable
advances and breakthroughs in measurement science, standards, material
characterization, instrumentation, testing, and manufacturing
capabilities that will accelerate the underlying research and
development for design, development, and manufacturability of next
generation microelectronics and ensure the competitiveness and
leadership of the United States within this sector.
(b) Components.--The program required by subsection (a) shall cover
the following:
(1) Advanced metrology and characterization for
manufacturing of microchips using 3 nanometer transistor
processes or more advanced processes.
(2) Metrology for security and supply chain verification.
(3) Creation of a Manufacturing USA institute described in
section 34(d) of the National Institute of Standards and
Technology Act (15 U.S.C. 278s(d)) that is focused on
semiconductor manufacturing. Such institute may emphasize the
following:
(A) Research to support the virtualization and
automation of maintenance of semiconductor machinery.
(B) Development of new advanced test, assembly and
packaging capabilities.
(C) Developing and deploying educational and skills
training curricula needed to support the industry
sector and ensure the U.S. can build and maintain a
trusted and predictable talent pipeline.
(c) Authorization of Appropriations.--There are authorized to be
appropriated to the Secretary amounts as follows:
(1) To carry out subsection (b)(1), $10,000,000 for each of
fiscal years 2021 through 2025.
(2) To carry out subsection (b)(2), $10,000,000 for each of
fiscal years 2021 through 2025.
(3) To carry out subsection (b)(3), $30,000,000 for each of
fiscal years 2021 through 2025.
SEC. 4. FEDERAL GRANTS TO MATCH STATE INCENTIVES.
(a) Definitions.--In this section--
(1) the term ``appropriate committees of Congress'' means--
(A) the Select Committee on Intelligence, the
Committee on Commerce, Science, and Transportation, the
Committee on Foreign Relations, the Committee on Armed
Services, and the Committee on Homeland Security and
Governmental Affairs of the Senate; and
(B) the Permanent Select Committee on Intelligence,
the Committee on Energy and Commerce, the Committee on
Foreign Affairs, the Committee on Armed Services, the
Committee on Science, Space, and Technology, and the
Committee on Homeland Security of the House of
Representatives;
(2) the term ``covered incentive''--
(A) means an incentive offered by a governmental
entity to a private entity for the purposes of building
within the jurisdiction of the governmental entity a
fabrication (or other essential) facility relating to
the manufacturing of semiconductors; and
(B) includes any tax incentive (such as an
incentive or reduction with respect to employment or
payroll taxes or a tax abatement with respect to
personal or real property), a workforce-related
incentive (including a grant agreement relating to
workforce training or vocational education), any
concession with respect to real property, and any other
incentive determined appropriate by the Secretary, in
consultation with the Secretary of State;
(3) the term ``governmental entity'' means a State or local
government; and
(4) the term ``Secretary'' means the Secretary of Commerce.
(b) Grants.--
(1) In general.--The Secretary shall establish in the
Department of Commerce a program that, in accordance with the
requirements of this section, provides grants to governmental
entities that offer covered incentives.
(2) Procedure.--
(A) In general.--A governmental entity that offers
a covered incentive and that desires to receive a grant
under this subsection shall submit to the Secretary an
application that describes the covered incentive
offered by the governmental entity.
(B) Conditions for approval.--The Secretary shall
approve an application submitted by a governmental
entity under subparagraph (A)--
(i) upon confirmation by the Secretary that
the private entity to which the governmental
entity has offered the covered incentive to
which the application relates has agreed to
build in the applicable jurisdiction a facility
described in subsection (a)(2)(A); and
(ii) if the Secretary determines that
building the facility described in clause (i)
is in the interest of the United States.
(3) Amount.--The amount of a grant provided by the
Secretary to a governmental entity under this subsection shall
be in an amount that is not less than the value of the
applicable covered incentive offered by the governmental
entity, as determined by the Secretary.
(4) Clawback.--The Secretary shall recover the full amount
of a grant made to a governmental entity under this subsection
with respect to a covered incentive offered by the governmental
entity if--
(A) as of the date that is 5 years after the date
on which the Secretary makes the grant, the facility to
which the covered incentive relates has not been
completed; or
(B) during the term of the grant, the private
entity to which the covered incentive was offered
engages in any joint research or technology licensing
effort--
(i) with the Government of the People's
Republic of China, the Government of the
Russian Federation, the Government of Iran, or
the Government of North Korea; and
(ii) that relates to a sensitive technology
or product, as determined by the Secretary.
(c) Consultation and Coordination Required.--In carrying out the
program established under subsection (b), the Secretary shall consult
and coordinate with the Secretary of State.
(d) GAO Reviews.--The Comptroller General of the United States
shall--
(1) not later than 2 years after the date of enactment of
this Act, and biennially thereafter until the date that is 10
years after that date of enactment, conduct a review of the
program established under subsection (b), which shall include a
determination of the number of grants made under that program
during the period covered by the review that failed to comply
with a requirement under this section; and
(2) submit to the appropriate committees of Congress the
results of each review conducted under paragraph (1).
(e) Trust Fund.--
(1) Establishment.--There is established in the Treasury of
the United States a trust fund (referred to in this subsection
as the ``Trust Fund''), consisting of amounts transferred to
the Trust Fund under paragraph (2) and any amounts that may be
credited to the Trust Fund under paragraph (3).
(2) Transfer of amounts.--
(A) In general.--Subject to subparagraph (B), the
Secretary of the Treasury shall transfer to the Trust
Fund, from the general fund of the Treasury, for fiscal
year 2021 and each fiscal year thereafter, an amount
equivalent to the amount received into the general fund
during that fiscal year and attributable to duties
imposed under section 301 of the Trade Act of 1974 (19
U.S.C. 2411).
(B) Limitations.--
(i) Limitation on transfers.--The amount
transferred to the Trust Fund under
subparagraph (A) in a fiscal year may not
exceed $10,000,000,000.
(ii) Limitation on total balance.--The
total amount in the Trust Fund at any one time
may not exceed $10,000,000,000.
(C) Frequency of transfers.--The Secretary shall
transfer amounts required to be transferred to the
Trust Fund under this paragraph not less frequently
than quarterly from the general fund of the Treasury to
the Trust Fund.
(3) Investment of amounts.--
(A) Investment of amounts.--The Secretary shall
invest such portion of the Trust Fund as is not
required to meet current withdrawals in interest-
bearing obligations of the United States or in
obligations guaranteed as to both principal and
interest by the United States.
(B) Interest and proceeds.--The interest on, and
the proceeds from the sale or redemption of, any
obligations held in the Trust Fund shall be credited to
and form a part of the Trust Fund.
(4) Availability of amounts in trust fund.--Amounts in the
Trust Fund shall be available, as provided in advance in an
appropriations Act, to the Secretary to make grants under this
section.
SEC. 5. DEPARTMENT OF DEFENSE SUPPORT FOR SEMICONDUCTOR TECHNOLOGIES
AND RELATED TECHNOLOGIES.
(a) RDT&E and Workforce Training Efforts.--
(1) In general.--The Secretary of Defense shall, in
consultation with the Secretary of Commerce and the Secretary
of Labor, establish and implement a priority in the use of
amounts available to the Department of Defense for research,
development, test, and evaluation, and for workforce training,
for programs, projects, and activities in connection with
semiconductor technologies and related technologies.
(2) Discharge.--The Secretary of Defense shall carry out
paragraph (1) through the Office of the Under Secretary of
Defense for Research and Engineering or such other component of
the Department of Defense as the Secretary considers
appropriate.
(3) Funding.--Of the amount authorized to be appropriated
for each fiscal year for the Department of Defense for
research, development, test, and evaluation, not less the
$50,000,000 shall be available in such fiscal year for
programs, projects, and activities described in paragraph (1)
in furtherance of the priority required by that paragraph.
(b) DPA Efforts.--
(1) In general.--Not later than 120 days after the date of
the enactment of this Act, the President shall submit to
Congress a report on, and shall commence implementation of, a
plan for use by the Department of Defense of authorities
available in title III of the Defense Production Act of 1950
(50 U.S.C. 4531 et seq.) to establish and enhance a domestic
production capability for semiconductor technologies and
related technologies, if funding is available for that purpose.
(2) Consultation.--The President shall develop the plan
required by paragraph (1) in consultation with the Secretary of
Defense, the Secretary of State, the Secretary of Commerce, and
appropriate stakeholders in the private sector.
SEC. 6. DEPARTMENT OF COMMERCE STUDY ON STATUS OF SEMICONDUCTOR
TECHNOLOGIES IN THE UNITED STATES INDUSTRIAL BASE.
(a) In General.--Commencing not later than 90 days after the date
of the enactment of this Act, the Secretary of Commerce shall undertake
a survey, using authorities in section 705 of the Defense Production
Act (50 U.S.C. 4555), to assess the capabilities of the United States
industrial base to support the national defense in light of the global
nature of the supply chain and significant interdependencies between
the United States industrial base and the industrial base of foreign
countries with respect to the manufacture and design of semiconductors.
(b) Response to Survey.--The Secretary shall ensure compliance with
the survey from among all relevant potential respondents, including the
following:
(1) Corporations, partnerships, associations, or any other
organized groups domiciled and with substantial operations in
the United States.
(2) Corporations, partnerships, associations, or any other
organized groups domiciled in the United States with operations
outside the United States.
(3) Foreign domiciled corporations, partnerships,
associations, or any other organized groups with substantial
operations or business presence in, or substantial revenues
derived from, the United States.
(4) Foreign domiciled corporations, partnerships,
associations, or any other organized groups in defense treaty
or assistance countries where the production of the entity
concerned involves critical technologies covered by section 3.
(c) Information Requested.--The information sought from a
responding entity pursuant to the survey required by subsection (a)
shall include, at minimum, information on the following with respect to
the manufacture or design of semiconductors by such entity:
(1) An identification of the geographic scope of
operations.
(2) Information on relevant cost structures.
(3) An identification of types of semiconductor equipment
in operation at such entity.
(4) An identification of all relevant raw materials and
semi-finished goods and components sourced domestically and
abroad by such entity.
(5) Specifications of the semiconductors manufactured or
designed by such entity, descriptions of the end-uses of such
semiconductors, and a description of any technical support
provided to end-users of such semiconductors by such entity.
(6) Information on domestic and export market sales by such
entity.
(7) Information on the financial performance, including
income and expenditures, of such entity.
(8) A list of all foreign and domestic subsidies, and any
other financial incentives, received by such entity in each
market in which such entity operates.
(9) A list of information requests from the People's
Republic of China to such entity, and a description of the
nature of each request and the type of information provided.
(10) Information on any joint ventures, technology
licensing agreements, and cooperative research or production
arrangements of such entity.
(11) A description of efforts by such entity to evaluate
and control supply chain risks it faces.
(12) A list and description of any sales, licensing
agreements, or partnerships between such entity and the
People's Liberation Army or People's Armed Police, including
any business relationships with entities through which such
sales, licensing agreements, or partnerships may occur.
SEC. 7. FUNDING FOR DEVELOPMENT AND ADOPTION OF SECURE MICROELECTRONICS
AND SECURE MICROELECTRONICS SUPPLY CHAINS.
(a) Multilateral Microelectronics Security Fund.--
(1) Establishment of fund.--There is established in the
Treasury of the United States a trust fund, to be known as the
``Multilateral Microelectronics Security Fund'' (in this
section referred to as the ``Fund''), consisting of amounts
deposited into the Trust Fund under paragraph (2) and any
amounts that may be credited to the Trust Fund under paragraph
(3).
(2) Authorization of appropriations.--There are authorized
to be appropriated $750,000,000 to be deposited in the Fund.
(3) Investment of amounts.--
(A) Investment of amounts.--The Secretary of the
Treasury shall invest such portion of the Fund as is
not required to meet current withdrawals in interest-
bearing obligations of the United States or in
obligations guaranteed as to both principal and
interest by the United States.
(B) Interest and proceeds.--The interest on, and
the proceeds from the sale or redemption of, any
obligations held in the Fund shall be credited to and
form a part of the Fund.
(4) Use of fund.--
(A) In general.--Subject to subparagraph (B),
amounts in the Fund shall be available, as provided in
advance in an appropriations Act, to the Secretary of
State--
(i) to provide funding through the common
funding mechanism described in subsection
(b)(1) to support the development and adoption
of secure microelectronics and secure
microelectronics supply chains; and
(ii) to otherwise carry out this section.
(B) Availability contingent on international
agreement.--Amounts in the Fund shall be available to
the Secretary of State on and after the date on which
the Secretary enters into an agreement with the
governments of countries that are partners of the
United States to participate in the common funding
mechanism under paragraph (1) of subsection (b) and the
commitments described in paragraph (2) of that
subsection.
(5) Availability of amounts.--
(A) In general.--Amounts in the Fund shall remain
available through the end of the tenth fiscal year
beginning after the date of the enactment of this Act.
(B) Remainder to treasury.--Any amounts remaining
in the Fund after the end of the fiscal year described
in subparagraph (A) shall be deposited in the general
fund of the Treasury.
(b) Common Funding Mechanism for Development and Adoption of Secure
Microelectronics and Secure Microelectronics Supply Chains.--
(1) In general.--The Secretary of State, in consultation
with the Secretary of Commerce, the Secretary of Defense, the
Secretary of Homeland Security, the Secretary of the Treasury,
and the Director of National Intelligence, shall seek to
establish a common funding mechanism, in coordination with the
governments of countries that are partners of the United
States, that uses amounts from the Fund, and amounts committed
by such governments, to support the development and adoption of
secure microelectronics and secure microelectronics supply
chains.
(2) Mutual commitments.--The Secretary of State, in
consultation with the United States Trade Representative and
the Secretary of Commerce, shall seek to negotiate a set of
mutual commitments with the governments of countries that are
partners of the United States upon which to condition any
expenditure of funds pursuant to the common funding mechanism
described in paragraph (1). Such commitments shall, at a
minimum--
(A) establish transparency requirements for any
subsidies or other financial benefits (including
revenue foregone) provided to microelectronics firms
located in or outside such countries;
(B) establish consistent policies with respect to
countries that--
(i) are not participating in the common
funding mechanism; and
(ii) do not meet transparency requirements
established under subparagraph (A);
(C) promote harmonized treatment of
microelectronics and verification processes for items
being exported to a country considered a national
security risk by a country participating in the common
funding mechanism;
(D) establish consistent policies and common
external policies to address nonmarket economies as the
behavior of such countries pertains to
microelectronics; and
(E) align policies on supply chain integrity and
microelectronics security.
(c) Annual Report to Congress.--Not later than one year after the
date of the enactment of this Act, and annually thereafter for each
fiscal year during which amounts in the Fund are available under
subsection (a)(3), the Secretary of State shall submit to Congress a
report on the status of the implementation of this section that
includes a description of--
(1) any commitments made by the governments of countries
that are partners of the United States to providing funding for
the common funding mechanism described in subsection (b)(1) and
the specific amount so committed;
(2) the criteria established for expenditure of funds
through the common funding mechanism;
(3) how, and to whom, amounts have been expended from the
Fund;
(4) amounts remaining in the Fund;
(5) the progress of the Secretary of State toward entering
into an agreement with the governments of countries that are
partners of the United States to participate in the common
funding mechanism and the commitments described in subsection
(b)(2); and
(6) any additional authorities needed to enhance the
effectiveness of the Fund in achieving the security goals of
the United States.
SEC. 8. ADVANCED SEMICONDUCTOR RESEARCH AND DESIGN.
(a) Appropriate Committees of Congress.--In this section, the term
``appropriate committees of Congress'' means--
(1) the Select Committee on Intelligence, the Committee on
Commerce, Science, and Transportation, the Committee on Foreign
Relations, the Committee on Armed Services, and the Committee
on Homeland Security and Governmental Affairs of the Senate;
and
(2) the Permanent Select Committee on Intelligence, the
Committee on Energy and Commerce, the Committee on Foreign
Affairs, the Committee on Armed Services, the Committee on
Science, Space, and Technology, and the Committee on Homeland
Security of the House of Representatives.
(b) Sense of Congress.--It is the sense of Congress that the
leadership of the United States in semiconductor technology and
innovation is critical to the economic growth and national security of
the United States.
(c) Subcommittee on Semiconductor Leadership.--
(1) Establishment required.--The President shall establish
in the National Science and Technology Council a subcommittee
on matters relating to leadership of the United States in
semiconductor technology and innovation.
(2) Duties.--The duties of the subcommittee established
under paragraph (1) are as follows:
(A) National strategy on semiconductor research.--
(i) Development.--In coordination with the
Secretary of Defense, the Secretary of Energy,
the Secretary of State, the Secretary of
Commerce, the National Science Foundation, and
the Director of the National Institute of
Standards and Technology and in consultation
with the semiconductor industry and academia,
develop a national strategy on semiconductor
research, including guidance for the funding of
research.
(ii) Reporting and updates.--Not less
frequently than once every 5 years, to update
the strategy developed under clause (i) and to
submit the revised strategy to the appropriate
committees of Congress.
(B) Fostering coordination of research and
development.--To foster the coordination of
semiconductor research and development.
(d) Advanced Packaging National Manufacturing Institute.--
(1) Authorization.--The Secretary of Commerce may, in
coordination with the private sector, establish in the
Department of Commerce an institute on advanced packaging and
manufacturing.
(2) Functions.--The functions of the institute established
under paragraph (1) shall be as follows:
(A) To establish United States leadership in
advanced microelectronic packaging.
(B) To promote standards development for such
packaging.
(C) To foster public-private partnerships relevant
to such packaging.
(D) To develop research and development programs to
advance technology development relevant to such
packaging.
(E) To establish an investment fund--
(i) to support a startup domestic advanced
microelectronic packaging ecosystem;
(ii) to accelerate technology transfer; and
(iii) to ensure domestic supply chains; and
(F) to work with the Secretary of Labor and the
private sector to develop workforce training programs
and apprenticeships in advanced microelectronic
packaging capabilities.
(e) Authorizations of Appropriations.--
(1) National semiconductor technology center.--There is
authorized to be appropriated to establish a national
semiconductor technology center to conduct research and
prototyping of advance semiconductors with participation of the
private sector, the Secretary of Defense, the Secretary of
Energy, the National Science Foundation, and the Director of
the National Institute of Standards and Technology,
$3,000,000,000 for fiscal year 2021, with such amount to remain
available for such purpose through fiscal year 2030.
(2) Electronics resurgence initiative.--There is authorized
to be appropriated to carry out the Electronics Resurgence
Initiative of the Defense Advanced Research Projects Agency,
$2,000,000,000 for fiscal year 2021, with such amount to remain
available for such purpose through fiscal year 2025.
(3) Semiconductor basic research at national science
foundation.--There is authorized to be appropriated to carry
out programs at the National Science Foundation on
semiconductor basic research, $3,000,000,000 for fiscal year
2021, with such amount to remain available for such purpose
through fiscal year 2025.
(4) Semiconductor basic research at department of energy.--
There is authorized to be appropriated to carry out programs at
the Department of Energy on semiconductor basic research,
$2,000,000,000 for fiscal year 2021, with such amount to remain
available for such purpose through fiscal year 2025.
(5) Advanced packaging national manufacturing institute.--
There is authorized to be appropriated to carry out subsection
(d), $5,000,000,000 for fiscal year 2021, with such amount to
remain available for such purpose through fiscal year 2025--
(A) of which, $500,000,000 shall be available to
carry out paragraph (2)(D) of such subsection; and
(B) of which, $500,000,000 shall be available to
carry out paragraph (2)(E) of such subsection.
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Introduced in House
Introduced in House
Referred to the Committee on Science, Space, and Technology, and in addition to the Committees on Ways and Means, Armed Services, Financial Services, Energy and Commerce, and Foreign Affairs, for a period to be subsequently determined by the Speaker, in each case for consideration of such provisions as fall within the jurisdiction of the committee concerned.
Referred to the Committee on Science, Space, and Technology, and in addition to the Committees on Ways and Means, Armed Services, Financial Services, Energy and Commerce, and Foreign Affairs, for a period to be subsequently determined by the Speaker, in each case for consideration of such provisions as fall within the jurisdiction of the committee concerned.
Referred to the Committee on Science, Space, and Technology, and in addition to the Committees on Ways and Means, Armed Services, Financial Services, Energy and Commerce, and Foreign Affairs, for a period to be subsequently determined by the Speaker, in each case for consideration of such provisions as fall within the jurisdiction of the committee concerned.
Referred to the Committee on Science, Space, and Technology, and in addition to the Committees on Ways and Means, Armed Services, Financial Services, Energy and Commerce, and Foreign Affairs, for a period to be subsequently determined by the Speaker, in each case for consideration of such provisions as fall within the jurisdiction of the committee concerned.
Referred to the Committee on Science, Space, and Technology, and in addition to the Committees on Ways and Means, Armed Services, Financial Services, Energy and Commerce, and Foreign Affairs, for a period to be subsequently determined by the Speaker, in each case for consideration of such provisions as fall within the jurisdiction of the committee concerned.
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Referred to the Committee on Science, Space, and Technology, and in addition to the Committees on Ways and Means, Armed Services, Financial Services, Energy and Commerce, and Foreign Affairs, for a period to be subsequently determined by the Speaker, in each case for consideration of such provisions as fall within the jurisdiction of the committee concerned.